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TLV2352Y
5 mV
TLV2352MU
CHIP
FORM
(Y)
鈥?40掳C to
85掳C
鈥?55掳C to
125掳C
5 mV
鈥?The D package is available taped and reeled. Add the suffix R to the device type (e.g., TLV2352IDR).
鈥?The PW packages are only available left-ended taped and reeled (e.g., TLV2352IPWLE)
These devices have limited built-in protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinCMOS is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
漏
1999, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
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DALLAS, TEXAS 75265
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