Philips Semiconductors
Objective speci铿乧ation
Power stage 2
脳
80 W class-D
audio ampli铿乪r
TDA8927
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-2
E
D
x
A
X
c
y
E2
HE
v
M
A
D1
D2
1
pin 1 index
Q
A2
E1
A4
Lp
detail X
24
Z
e
bp
13
w
M
(A3)
胃
A
12
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
A2
max.
3.5
3.5
3.2
A3
0.35
A4
(1)
bp
c
D
(2)
D1
D2
1.1
0.9
E
(2)
11.1
10.9
E1
6.2
5.8
E2
2.9
2.5
e
1.0
HE
14.5
13.9
Lp
1.1
0.8
Q
1.7
1.5
v
w
x
y
Z
2.7
2.2
胃
8掳
0掳
+0.12
0.53 0.32 16.0 13.0
鈭?.02
0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT566-2
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
00-03-24
2001 Dec 11
32