您的位置：维库电子市场网 > Datasheet > TDA8927
TDA8927数据手册封面

TDA8927 Datasheet

  • TDA8927

  • Power stage 2 X 80 W class-D

  • 336.42KB

  • Philips

阅览下载 纠错 0

扫码查看芯片数据手册

上传产品规格书

PDF预览

Philips Semiconductors
Objective speci铿乧ation
Power stage 2
脳
80 W class-D
audio ampli铿乪r
17 SOLDERING
17.1
Introduction
TDA8927
Typical reflow peak temperatures range from
215 to 250
掳C.
The top-surface temperature of the
packages should preferable be kept below 220
掳C
for
thick/large packages, and below 235
掳C
for small/thin
packages.
17.3.2
W
AVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
鈥淒ata Handbook IC26; Integrated Circuit Packages鈥?/div>
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.
17.2
17.2.1
Through-hole mount packages
S
OLDERING BY DIPPING OR BY SOLDER WAVE
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
鈥?/div>
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
鈥?/div>
For packages with leads on two sides and a pitch (e):
鈥?larger than or equal to 1.27 mm, the footprint
longitudinal axis is
preferred
to be parallel to the
transport direction of the printed-circuit board;
鈥?smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
鈥?/div>
For packages with leads on four sides, the footprint must
be placed at a 45掳 angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
掳C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
17.3.3
M
ANUAL SOLDERING
The maximum permissible temperature of the solder is
260
掳C;
solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
17.2.2
M
ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
掳C
it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
掳C,
contact may be up to 5 seconds.
17.3
17.3.1
Surface mount packages
R
EFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
掳C.
When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320
掳C.
33
2001 Dec 11

TDA8927相关型号PDF文件下载

您可能感兴趣的PDF文件资料

热门IC型号推荐

©2024 维库电子市场网（www.dzsc.com）　备案号：浙B2-20050339-1 经营许可证：浙B2-20210386版权声明
买家服务热线：0571-85317607 | 买家服务部QQ： QQ:1609526468
卖家服务热线：0571-85317607 | 卖家服务部QQ： QQ:331652727

扫码下载APP，
一键连接广大的电子世界。

在线人工客服

买家服务：
卖家服务：

0571-85317607

客服在线时间周一至周五
9:00-17:30

关注官方微信号，
第一时间获取资讯。

建议反馈
返回顶部

建议反馈

联系人：

联系方式：

按住滑块，拖拽到最右边
>>
感谢您向阿库提出的宝贵意见，您的参与是维库提升服务的动力！意见一经采纳，将有感恩红包奉上哦！

PDF纠错X

投诉电话：0571-85317607 投诉QQ：

如选匿名将无法为您反馈投诉结果，建议实名投诉！