Philips Semiconductors
Objective speci铿乧ation
Power stage 2
脳
80 W class-D
audio ampli铿乪r
17.4
Suitability of IC packages for wave, re铿俹w and dipping soldering methods
TDA8927
SOLDERING METHOD
MOUNTING
PACKAGE
WAVE
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
鈥淒ata Handbook IC26; Integrated Circuit Packages; Section: Packing Methods鈥?
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45掳 angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
suitable
(2)
not suitable
not suitable
(3)
suitable
not recommended
(6)
REFLOW
(1)
DIPPING
鈭?/div>
suitable
suitable
suitable
suitable
suitable
鈭?/div>
鈭?/div>
鈭?/div>
鈭?/div>
鈭?/div>
not recommended
(4)(5)
suitable
2001 Dec 11
34
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