24AA01/24LC01B
8-Lead Plastic Thin Shrink Small Outline (ST) 鈥?4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
伪
A
c
蠁
尾
L
A1
A2
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff 搂
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
搂 Significant Characteristic
Units
Dimension Limits
n
p
A
A2
A1
E
E1
D
L
蠁
c
B
伪
尾
MIN
INCHES
NOM
8
.026
MAX
.033
.002
.246
.169
.114
.020
0
.004
.007
0
0
.035
.004
.251
.173
.118
.024
4
.006
.010
5
5
.043
.037
.006
.256
.177
.122
.028
8
.008
.012
10
10
MILLIMETERS*
MIN
NOM
MAX
8
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
2.90
3.00
3.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005鈥?(0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
铮?/div>
2003 Microchip Technology Inc.
DS21711C-page 15
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