LTAEZ Datasheet

IC型号：
LTAEZ
PDF描述：
Linear Integrated Systems [Differential Input 16-Bit No Lat...
文件大小：
306.93KB
芯片厂家：
LINEAR

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LTC2433-1

PACKAGE DESCRIPTIO

5.23

(.206)

MIN

0.50

0.305

卤

0.038

(.0197)

(.0120

卤

.0015)

BSC

TYP

RECOMMENDED SOLDER PAD LAYOUT

0.254

(.010)

GAUGE PLANE

0.18

(.007)

SEATING

PLANE

0.17 鈥?0.27

(.007 鈥?.011)

TYP

0.13

卤

0.076

(.005

卤

.003)

MSOP (MS) 0802

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

MS Package

10-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1661)

0.889

卤

0.127

(.035

卤

.005)

3.2 鈥?3.45

(.126 鈥?.136)

3.00

卤

0.102

(.118

卤

.004)

(NOTE 3)

10 9 8 7 6

0.497

卤

0.076

(.0196

卤

.003)

REF

DETAIL 鈥淎鈥?/div>

0掳鈥?6掳 TYP

1 2 3 4 5

0.53

卤

0.01

(.021

卤

.006)

DETAIL 鈥淎鈥?/div>

1.10

(.043)

MAX

0.86

(.034)

REF

4.90

卤

0.15

(1.93

卤

.006)

3.00

卤

0.102

(.118

卤

.004)

NOTE 4

0.50

(.0197)

BSC

24331fa

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