24AA08/24LC08B
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) 鈥?Saw Singulated
p
D
b
n
L
E
E2
PIN 1
ID INDEX
AREA
(NOTE 2)
EXPOSED
METAL
PAD
D2
2
1
TOP VIEW
BOTTOM VIEW
A
A3
A1
EXPOSED
TIE BAR
(NOTE 1)
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Contact Width
Contact Length
Units
Dimension Limits
n
p
A
A1
A3
D
D2
E
E2
b
L
MIN
.031
.000
(Note 3)
.055
.047
.008
.012
(Note 3)
INCHES
NOM
8
.020 BSC
.035
.001
.008 REF.
.079 BSC
--
.118 BSC
--
.010
.016
MAX
MIN
.039
.002
0.80
0.00
.064
.071
.012
.020
1.39
1.20
0.20
0.30
MILLIMETERS*
NOM
8
0.50 BSC
0.90
0.02
0.20 REF.
2.00 BSC
--
3.00 BSC
--
0.25
0.40
MAX
1.00
0.05
1.62
1.80
0.30
0.50
*Controlling Parameter
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Exposed pad dimensions vary with paddle size.
4. JEDEC equivalent: MO-229
Drawing No. C04-123
Revised 05/24/04
漏
2005 Microchip Technology Inc.
DS21710D-page 19