97SD3232RPME Datasheet

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1 Gb (8-Meg X 32-Bit X 4-Banks) SDRAM

Pinout Description

97SD3232

Memory

The 97SD3232 Consists of 4, 8-Meg X 8-Bit X 4-Banks, die.

The 132 Pin 2-layer stack package contains two die per layer. CLK1

clocks die 1 and 3, while CLK2 clocks die 2 and 4.

CKE 1-4, CS 1-4 and DQM 1-4 correspond to one of the die:

CKE1, CS1 and DQM1 control D0 - D7

CKE2, CS2 and DQM2 control D8 - D15

CKE3, CS3 and DQM3 control D16 - D23

CKE4, CS4 and DQM4 control D24 - D31

01.11.05 Rev 2

All data sheets are subject to change without notice

2

漏2005 Maxwell Technologies

All rights reserved.

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