Philips Semiconductors
Product speci铿乧ation
16-bit buffer/line driver; 5 V input/output
tolerant; 3-state
PACKAGE OUTLINES
74LVC16244A;
74LVCH16244A
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
SOT370-1
D
E
A
X
c
y
H
E
v
M
A
Z
48
25
Q
A
2
A
1
(A
3
)
胃
L
p
1
b
p
24
w
M
L
detail X
A
pin 1 index
e
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
2.8
A
1
0.4
0.2
A
2
2.35
2.20
A
3
0.25
b
p
0.3
0.2
c
0.22
0.13
D
(1)
16.00
15.75
E
(1)
7.6
7.4
e
0.635
H
E
10.4
10.1
L
1.4
L
p
1.0
0.6
Q
1.2
1.0
v
0.25
w
0.18
y
0.1
Z
(1)
0.85
0.40
胃
8
o
0
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT370-1
REFERENCES
IEC
JEDEC
MO-118
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
2003 Dec 08
14