5
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6,
HCNW4502/3)
11.15 卤 0.15
(0.442 卤 0.006)
8
7
6
5
LAND PATTERN RECOMMENDATION
9.00 卤 0.15
(0.354 卤 0.006)
13.56
(0.534)
1
2
3
4
1.3
(0.051)
1.55
(0.061)
MAX.
12.30 卤 0.30
(0.484 卤 0.012)
11.00 MAX.
(0.433)
2.29
(0.09)
4.00 MAX.
(0.158)
1.78 卤 0.15
(0.070 卤 0.006)
2.54
(0.100)
BSC
0.75 卤 0.25
(0.030 卤 0.010)
1.00 卤 0.15
(0.039 卤 0.006)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
7掳 NOM.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3掳C + 1掳C/鈥?.5掳C/SEC.
REFLOW HEATING RATE 2.5掳C 卤 0.5掳C/SEC.
PEAK
TEMP.
245掳C
PEAK
TEMP.
240掳C
PEAK
TEMP.
230掳C
2.5掳C 卤 0.5掳C/SEC.
160掳C
150掳C
140掳C
3掳C + 1掳C/鈥?.5掳C
30
SEC.
30
SEC.
SOLDERING
TIME
200掳C
TEMPERATURE (掳C)
200
100
PREHEATING TIME
150掳C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)