Philips Semiconductors
SC16C654B/654DB
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 x 6 x 0.85 mm
SOT778-3
D
B
A
terminal 1
index area
E
A
A
1
c
detail X
C
e
1
e
13
1/2 e
b
24
25
v
w
M
M
C A B
C
y
1
C
y
L
12
e
E
h
1/2 e
e
2
1
36
48
37
terminal 1
index area
X
0
2.5
scale
5 mm
D
h
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
(1)
max
1
A
1
0.05
0.00
b
0.25
0.15
c
0.2
D
(1)
6.1
5.9
D
h
3.95
3.65
E
(1)
6.1
5.9
E
h
3.95
3.65
e
0.4
e
1
4.4
e
2
4.4
L
0.5
0.3
v
0.1
w
0.05
y
0.05
y
1
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
OUTLINE
VERSION
SOT778-3
REFERENCES
IEC
---
JEDEC
---
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
04-06-16
04-06-23
Fig 30. Package outline SOT778-3 (HVQFN48)
9397 750 14965
漏 Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 鈥?20 June 2005
51 of 58