Philips Semiconductors
SC16C654B/654DB
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45掳 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
de铿乶itely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is de铿乶itely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on 铿俥x foil. However, the image sensor package can be mounted by the client on a 铿俥x foil by
using a hot bar soldering process. The appropriate soldering pro铿乴e can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
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[6]
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[8]
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13. Abbreviations
Table 30:
Acronym
BRG
CPU
DMA
FIFO
ISDN
LSB
MSB
QUART
UART
Abbreviations
Description
Baud Rate Generator
Central Processing Unit
Direct Memory Access
First-In, First-Out
Integrated Service Digital Network
Least Signi铿乧ant Bit
Most Signi铿乧ant Bit
4-channel (Quad) Universal Asynchronous Receiver and Transmitter
Universal Asynchronous Receiver and Transmitter
9397 750 14965
漏 Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 鈥?20 June 2005
55 of 58