ICL232
Absolute Maximum Ratings
V
CC
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V
CC
< 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (V
CC
-0.3V) < V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
Input Voltages
T1
IN
, T2
IN
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
IN
< (V+ +0.3V)
R1
IN
, R2
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
卤30V
Output Voltages
T1
OUT
, T2
OUT
. . . . . . . . . . . . . (V- -0.3V) < V
TXOUT
< (V+ +0.3V)
R1
OUT
, R2
OUT
. . . . . . . . . (GND -0.3V) < V
RXOUT
< (V
CC
+0.3V)
Short Circuit Duration
T1
OUT
, T2
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
R1
OUT
, R2
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Thermal Information
Thermal Resistance (Typical, Note 1)
胃
JA
(
o
C/W)
胃
JC
(
o
C/W)
CERDIP Package . . . . . . . . . . . . . . . . .
80
18
PDIP Package. . . . . . . . . . . . . . . . . . . .
100
N/A
SOIC Package . . . . . . . . . . . . . . . . . . .
100
N/A
Maximum Junction Temperature
Plastic Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Ceramic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
o
C
Maximum Storage Temperature Range . . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
o
C
Operating Conditions
Temperature Ranges
ICL232C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 70
o
C
ICL232I. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
ICL232M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
CAUTION: Stresses above those listed in 鈥淎bsolute Maximum Ratings鈥?may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
胃
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER
Test Conditions: V
CC
= +5V
Otherwise Specified
卤
10%, T
A
= Operating Temperature Range. Test Circuit as in Figure 8 Unless
MIN
卤5
-
-
2.0
TYP
卤9
5
-
-
15
-
5.0
1.2
1.7
0.5
0.1
4.6
0.5
-
3
-
卤10
MAX
卤10
10
0.8
-
200
+30
7.0
-
2.4
1.0
0.4
-
-
30
-
-
-
UNITS
V
mA
V
V
碌A
V
k鈩?/div>
V
V
V
V
V
碌s
V/碌s
V/碌s
鈩?/div>
mA
TEST CONDITIONS
T1
OUT
and T2
OUT
Loaded with 3k鈩?to
Ground
Outputs Unloaded, T
A
= 25
o
C
Transmitter Output Voltage Swing, T
OUT
Power Supply Current, I
CC
T
IN
, Input Logic Low, V
lL
T
IN
, Input Logic High, V
lH
Logic Pullup Current, I
P
RS-232 Input Voltage Range, V
IN
Receiver Input Impedance, R
IN
Receiver Input Low Threshold, V
lN
(H-L)
Receiver Input High Threshold, V
IN
(L-H)
Receiver Input Hysteresis, V
HYST
TTL/CMOS Receiver Output Voltage Low, V
OL
TTL/CMOS Receiver Output Voltage High, V
OH
Propagation Delay, t
PD
Instantaneous Slew Rate, SR
Transition Region Slew Rate, SR
T
Output Resistance, R
OUT
RS-232 Output Short Circuit Current, I
SC
NOTES:
2. Guaranteed by design.
3. See Figure 4 for definition.
T1
IN
, T2
IN
= 0V
-
-30
V
IN
=
卤3V
V
CC
= 5V, T
A
= 25
o
C
V
CC
= 5V, T
A
= 25
o
C
3.0
0.8
-
0.2
I
OUT
= 3.2mA
I
OUT
= -1.0mA
RS-232 to TTL
C
L
= 10pF, R
L
= 3k鈩? T
A
= 25
o
C
(Notes 2, 3)
R
L
= 3k鈩? C
L
= 2500pF Measured
from +3V to -3V or -3V to +3V
V
CC
= V+ = V- = 0V, V
OUT
=
卤2V
T1
OUT
or T2
OUT
Shorted to GND
-
3.5
-
-
-
300
-
3
FN3020.7
July 28, 2005
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