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Package Outlines
P-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
TFBGA Common Package Properties (non-green/green)
Size
0.460
0.350
0.450
Units
mm
mm
mm
There are two package types used for this product family each in lead-free and lead-containing assembly:
Table 32
Description
Ball Size
Recommended Landing Pad
Recommended Solder Mask
12
11 x 1 = 11
1
0.2
0.18 MAX.
8 x 0.8 = 6.4
1.8 MAX.
0.8
B
5)
8
3)
4)
A
5)
1)
0.05
2)
0.1 C
0.1 C
1.2 MAX.
0.31 MIN.
酶0.46
卤0.05
60x
酶0.15
M
A B
C
酶0.08
M
1.5
2)
4.25
C SEATING PLANE
1) A1 Marking Ballside
2) A1 Marking Chipside
3) Dummy Pads without Ball
4) Bad Unit Marking (BUM)
5) Middle of Packages Edges
2.24
GPA09555
Figure 54
Package Outline of P-TFBGA-60-12 (non-green/green)
Data Sheet
92
Rev. 1.6, 2004-12