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ADS5440 Datasheet

  • ADS5440

  • 13 位 210MSPS 管道 ADC

  • 1016.06KB

  • 24页

  • TI

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ADS5440
SLAS467 鈥?JULY 2005
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGING/ORDERING INFORMATION
(1)
Product
Package-
Lead
HTQFP-80
(2)
PowerPAD
Package
Designator
PFP
(1)
Specified
Temperature
Range
鈥?0掳C to 85掳C
Package
Marking
ADS5440I
Ordering
Number
ADS5440IPFP
ADS5440IPFPR
Transport
Media,
Quantity
Tray, 96
Tape and Reel, 1000
ADS5440
(1)
(2)
For the most current product and ordering information, see the Package Option Addendum located at the end of this data sheet.
Thermal pad size: 7,5 mm x 7,5 mm (typ)
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE / UNIT
Supply voltage
Analog input to GND
Clock input to GND
CLK to CLK
Digital data output to GND
Operating temperature range
Maximum junction temperature
Storage temperature range
(1)
AV
DD
to GND
DRV
DD
to GND
6V
5V
鈥?.3 V to AV
DD
+0.3 V
鈥?.3 V to AV
DD
+0.3 V
卤2.5
鈥?.3 V to DRV
DD
+0.3 V
鈥?0掳C to 85掳C
150掳C
鈥?5掳C to 150掳C
PRODUCT PREVIEW
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond
those specified is not implied.
THERMAL CHARACTERISTICS
(1)
PARAMETER
Soldered slug, no airflow
胃
JA
Soldered slug, 250-LFPM airflow
Unsoldered slug, no airflow
Unsoldered slug, 250-LFPM airflow
胃
JC
(1)
Bottom of package (heatslug)
TEST CONDITIONS
TYP
21.7
15.4
50
43.4
2.99
UNIT
掳C/W
掳C/W
掳C/W
掳C/W
掳C/W
Using 36 thermal vias (6 x 6 array). See the Application Section.
2

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