EL7563
Typical Performance Curves (20 Pin SO Package)
(Continued)
NOTE: The 28-Pin HTSSOP Package Offers Improved Performance
V
IN
=3.3V
1.8
1.6
1.4
POWER LOSS (W)
1.2
1
0.8
0.6
0.4
0.2
0
0
0.5
1
1.5
2
2.5
3
3.5
4
V
O
=2.5V
V
O
=1V
V
O
=1.2V
P
LOSS
(W)
V
O
=1.8V
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
1
2
I
O
(A)
3
4
V
O
=1.2V
V
O
=2.5V
OUTPUT CURRENT I
O
(A)
FIGURE 3. EL7563CM CONVERTER POWER LOSS vs I
O
V
O
=2.5V
V
IN
=3.6V
FIGURE 4. EL7563CRE TOTAL CONVERTER POWER LOSS
2.505
2.5
OUTPUT VOLTAGE (V)
2.495
0.6
0.4
0.2
V
O
(V) (%)
V
IN
=3.3V
0
-0.2
-0.4
-0.6
V
O
=2.5V
V
IN
=3.3V
V
IN
=3.6V
2.49
2.485
2.48
2.475
2.47
2.465
0.5
1
1.5
2
2.5
3
V
IN
=3V
V
IN
=3V
3.5
4
-0.8
0
0.5
1
1.5
2
I
O
(A)
2.5
3
3.5
4
LOAD CURRENT I
O
(A)
FIGURE 5. EL7563CM LOAD REGULATION
FIGURE 6. EL7563CRE LOAD REGULATION
50
THERMAL RESISTANCE (掳C/W)
46
42
38
TEST CONDITION:
CHIP IN THE CENTER OF COPPER AREA
50
45
胃
JA
(掳C/W)
40
35
30
CONDITION:
EL7563CRE THERMAL PAD SOLDERED TO 2-LAYER
PCB WITH 0.039鈥?THICKNESS AND 1 OZ. COPPER ON
BOTH SIDES
WITH NO AIRFLOW
WITH 100 LFPM AIRFLOW
34
30
1 OZ. COPPER PCB USED
1
1.5
2
2.5
3
3.5
4
25
0
1.5
2
2.5
3
3.5
4
PCB COPPER HEAT-SINKING AREA (in
2
)
PCB AREA (in
2
)
FIGURE 7. EL7563CM
胃
JA
vs COPPER AREA
FIGURE 8. EL7563CRE THERMAL RESISTANCE vs PCB
AREA - NO AIR FLOW
6
FN7296.2
May 13, 2005