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93C86A-I/P Datasheet

  • 93C86A-I/P

  • 1K-16K Microwire Compatible Serial EEPROMs

  • 411.22KB

  • MICROCHIP

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93XX46X/56X/66X/76X/86X
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
b
A
A2
c
蠁
e
A1
Units
Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
N
e
A
A2
A1
E
E1
D
L
L1
蠁
c
L1
MILLIMETERS
MIN
NOM
8
0.65 BSC
鈥?/div>
0.75
0.00
鈥?/div>
0.85
鈥?/div>
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0掳
0.08
0.60
0.95 REF
鈥?/div>
鈥?/div>
8掳
0.23
0.80
1.10
0.95
0.15
MAX
L
Lead Width
b
0.22
鈥?/div>
0.40
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-111B
DS21929D-page 30
漏
2007 Microchip Technology Inc.

93C86A-I/P 产品属性

  • Microchip

  • Tube

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