Philips Semiconductors
Product speci铿乧ation
Full bridge vertical de铿俥ction output circuit
in LVDMOS
PACKAGE OUTLINE
TDA8359J
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
non-concave
x
Eh
q1
Dh
D
D1
P
k
view
B:
mounting base side
A2
q2
E
B
q
L2
L
L3
L1
1
Z
e
DIMENSIONS (mm are the original dimensions)
UNIT A2
(2)
bp
mm
c
D
(1)
D1
(2)
Dh E
(1)
Eh
e
e1
9
w
M
0
5
scale
e1
e2
k
L
L1
L2
L3
4.5
3.7
m
2.8
P
Q
q
q1
q2
v
0.8
w
x
Z
(1)
1.65
1.10
10 mm
Q
m
e2
c
v
M
bp
2.7 0.80 0.58 13.2
2.3 0.65 0.48 12.8
6.2
14.7
3.0 12.4 11.4 6.7
3.5
3.5 2.54 1.27 5.08
5.8
14.3
2.0 11.0 10.0 5.5
3.4 1.15 17.5
4.85 3.8
3.1 0.85 16.3
3.6
0.3 0.02
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
OUTLINE
VERSION
SOT523-1
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
98-11-12
00-07-03
2002 Jan 21
14