MPC9600 Datasheet

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Freescale Semiconductor, Inc.

OUTLINE DIMENSIONS

FA SUFFIX

LQFP PACKAGE

CASE 932鈥?3

ISSUE F

0.200 AB T鈥揢 Z

9

A1

48

37

4X

A

DETAIL Y

P

1

36

T

U

V

Freescale Semiconductor, Inc...

B

B1

12

25

AE

V1

AE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETER.

3.DATUM PLANE AB IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4.DATUMS T, U, AND Z TO BE DETERMINED AT

DATUM PLANE AB.

5.DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE AC.

6.DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.250 PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE AB.

7.DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.350.

8.MINIMUM SOLDER PLATE THICKNESS SHALL BE

0.0076.

9.EXACT SHAPE OF EACH CORNER IS OPTIONAL.

MILLIMETERS

MIN

MAX

7.000 BSC

3.500 BSC

7.000 BSC

3.500 BSC

1.400

1.600

0.170

0.270

1.350

1.450

0.170

0.230

0.500 BSC

0.050

0.150

0.090

0.200

0.500

0.700

0

_

7

_

12

_

REF

0.090

0.160

0.250 BSC

0.150

0.250

9.000 BSC

4.500 BSC

9.000 BSC

4.500 BSC

0.200 REF

1.000 REF

13

24

Z

S1

S

4X

T, U, Z

DETAIL Y

0.200 AC T鈥揢 Z

AB

G

0.080 AC

AD

AC

BASE METAL

DIM

A

A1

B

B1

C

D

E

F

G

H

J

K

L

M

N

P

R

S

S1

V

V1

W

AA

M

_

TOP & BOTTOM

R

GAUGE PLANE

0.080

SECTION AE鈥揂E

TIMING SOLUTIONS

脡脡脡

脟脟脟

脡脡脡

脟脟脟

脡脡脡

脟脟脟

F

D

M

C

E

AC T鈥揢 Z

H

DETAIL AD

AA

W

K

L

_

For More Information On This Product,

13

Go to: www.freescale.com

0.250

N

J

MOTOROLA

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