PIC16CR83 Datasheet

IC型号：
PIC16CR83
PDF描述：
18-pin Flash/EEPROM 8-Bit Microcontrollers
文件大小：
2018.18KB
PDF页数：
125页
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PIC16F8X

8.2.3

EXTERNAL CRYSTAL OSCILLATOR

CIRCUIT

8.2.4

RC OSCILLATOR

For timing insensitive applications the RC device option

offers additional cost savings. The RC oscillator

frequency is a function of the supply voltage, the

resistor (Rext) values, capacitor (Cext) values, and the

operating temperature. In addition to this, the oscillator

frequency will vary from unit to unit due to normal

process parameter variation. Furthermore, the

difference in lead frame capacitance between package

types also affects the oscillation frequency, especially

for low Cext values. The user needs to take into

account variation due to tolerance of the external

R and C components. Figure 8-7 shows how an R/C

combination is connected to the PIC16F8X. For Rext

values below 4 k鈩? the oscillator operation may

become unstable, or stop completely. For very high

Rext values (e.g., 1 M鈩?, the oscillator becomes

sensitive to noise, humidity and leakage. Thus, we

recommend keeping Rext between 5 k鈩?and 100 k鈩?

Although the oscillator will operate with no external

capacitor (Cext = 0 pF), we recommend using values

above 20 pF for noise and stability reasons. With little

or no external capacitance, the oscillation frequency

can vary dramatically due to changes in external

capacitances, such as PCB trace capacitance or

package lead frame capacitance.

See the electrical speci铿乧ation section for RC

frequency variation from part to part due to normal

process variation. The variation is larger for larger R

(since leakage current variation will affect RC

frequency more for large R) and for smaller C (since

variation of input capacitance has a greater affect on

RC frequency).

See the electrical speci铿乧ation section for variation of

oscillator frequency due to V

for given Rext/Cext

values as well as frequency variation due to

operating temperature.

The oscillator frequency, divided by 4, is available on

the OSC2/CLKOUT pin, and can be used for test

purposes or to synchronize other logic (see Figure 3-2

for waveform).

Either a prepackaged oscillator can be used or a simple

oscillator circuit with TTL gates can be built.

Prepackaged oscillators provide a wide operating

range and better stability. A well-designed crystal

oscillator will provide good performance with TTL

gates. Two types of crystal oscillator circuits are

available; one with series resonance, and one with

parallel resonance.

Figure 8-5 shows a parallel resonant oscillator circuit.

The circuit is designed to use the fundamental

frequency of the crystal. The 74AS04 inverter performs

the 180-degree phase shift that a parallel oscillator

requires. The 4.7 k鈩?resistor provides negative

feedback for stability. The 10 k鈩?potentiometer biases

the 74AS04 in the linear region. This could be used for

external oscillator designs.

FIGURE 8-5:

EXTERNAL PARALLEL

RESONANT CRYSTAL

OSCILLATOR CIRCUIT

To Other

Devices

+5V

10k

4.7k

74AS04

CLKIN

PIC16FXX

10k

XTAL

10k

20 pF

Figure 8-6 shows a series resonant oscillator circuit.

This circuit is also designed to use the fundamental

frequency of the crystal. The inverter performs a

180-degree phase shift. The 330 k鈩?resistors provide

the negative feedback to bias the inverters in their

linear region.

FIGURE 8-7:

RC OSCILLATOR MODE

FIGURE 8-6:

EXTERNAL SERIES

RESONANT CRYSTAL

OSCILLATOR CIRCUIT

To Other

Devices

74AS04

CLKIN

Rext

OSC1

Cext

Internal

clock

PIC16FXX

OSC2/CLKOUT

5 k鈩?/div>

鈮?/div>

Rext

鈮?/div>

100 k鈩?/div>

Cext > 20pF

330 k鈩?/div>

74AS04

0.1

碌F

XTAL

330 k鈩?/div>

74AS04

PIC16FXX

Fosc/4

Recommended values:

Note:

When the device oscillator is in RC mode,

do not drive the OSC1 pin with an external

clock or you may damage the device.

DS30430C-page 40

漏

1998 Microchip Technology Inc.

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