鈥?/div>
D021A
1.0
16
碌A
* These parameters are characterized but not tested.
鈥?Data in "Typ" column is at 5.0V, 25藲C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1:
This is the limit to which V
DD
can be lowered in SLEEP mode without losing RAM data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
DD
measurements in active operation mode are:
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD
, T0CKI = V
DD
,
MCLR = V
DD
; WDT enabled/disabled as speci铿乪d.
3:
The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD
and V
SS
.
4:
For RC osc con铿乬uration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula I
R
= V
DD
/2Rext (mA) with Rext in kOhm.
RC and XT osc con铿乬uration
(4)
F
OSC
= 4.0 MHz, V
DD
= 5.5V
F
OSC
= 4.0 MHz, V
DD
= 5.5V
(During EEPROM programming)
HS
OSC CONFIGURATION
(PIC16CR84-10)
F
OSC
= 10 MHz, V
DD
= 5.5V
V
DD
= 4.0V, WDT enabled, industrial
V
DD
= 4.0V, WDT disabled, commercial
V
DD
= 4.0V, WDT disabled, industrial
漏
1998 Microchip Technology Inc.
DS30430C-page 87