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SC16C754BIBM-S Datasheet

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Philips Semiconductors
SC16C754
Quad UART with 64-byte FIFO
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering can still
be used for certain surface mount ICs, but it is not suitable for 铿乶e pitch SMDs. In
these situations re铿俹w soldering is recommended. In these situations re铿俹w
soldering is recommended.
13.2 Re铿俹w soldering
Re铿俹w soldering requires solder paste (a suspension of 铿乶e solder particles, 铿倁x and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for re铿俹wing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical re铿俹w peak temperatures range from 215 to 270
掳C
depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
鈥?/div>
below 220
掳C
(SnPb process) or below 245
掳C
(Pb-free process)
鈥?/div>
for all BGA and SSOP-T packages
鈥?/div>
for packages with a thickness
鈮?/div>
2.5 mm
鈥?/div>
for packages with a thickness < 2.5 mm and a volume
鈮?/div>
350 mm
3
so called
thick/large packages.
鈥?/div>
below 235
掳C
(SnPb process) or below 260
掳C
(Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was speci铿乧ally
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
鈥?/div>
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
9397 750 11618
漏 Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data
Rev. 04 鈥?19 June 2003
45 of 49

SC16C754BIBM-S 产品属性

  • NXP

  • UART 接口集成电路

  • 4

  • 5 Mbps

  • 5.5 V

  • 2.25 V

  • 6 mA

  • + 85 C

  • - 40 C

  • LQFP-64

  • Bulk

  • SMD/SMT

  • 2.5 V, 3.3 V, 5 V

  • 250

  • SC16C754BIBM,151

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