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SC16C754BIBM-S Datasheet

  • SC16C754BIBM-S

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  • Philips

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Philips Semiconductors
SC16C754
Quad UART with 64-byte FIFO
These transparent plastic packages are extremely sensitive to re铿俹w soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared re铿俹w
soldering with peak temperature exceeding 217
掳C 卤
10
掳C
measured in the atmosphere of the re铿俹w
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45掳 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is de铿乶itely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is de铿乶itely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[3]
[4]
[5]
[6]
[7]
14. Revision history
Table 28:
Rev Date
04
20030619
Revision history
CPCN
-
Description
Product data (9397 750 11618); ECN 853-2411 30036 of 16 June 2003.
Modi铿乧ations:
鈥?/div>
鈥?/div>
鈥?/div>
03
02
01
20030415
20030314
20030124
-
-
-
Figure 13 鈥淐rystal oscillator connection.鈥?on page 20:
changed capacitors鈥?values and added
connection with resistor.
Table 25 鈥淒C electrical characteristics鈥?on page 35:
I
CCsleep
: change all values to 1 mA nom.
Table 26 鈥淎C electrical characteristics鈥?
add
Table note 2,
its reference to parameter 鈥業OW
strobe width鈥? and re-number subsequent note.
Product data (9397 750 11374); ECN 853-2411 29796 of 11 April 2003.
Product data (9397 750 11192); ECN 853-2411 29625 of 07 March 2003.
Product data (9397 750 10891); ECN 853-2411 29395 of 16 January 2003.
9397 750 11618
漏 Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data
Rev. 04 鈥?19 June 2003
47 of 49

SC16C754BIBM-S 产品属性

  • NXP

  • UART 接口集成电路

  • 4

  • 5 Mbps

  • 5.5 V

  • 2.25 V

  • 6 mA

  • + 85 C

  • - 40 C

  • LQFP-64

  • Bulk

  • SMD/SMT

  • 2.5 V, 3.3 V, 5 V

  • 250

  • SC16C754BIBM,151

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