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SC16C754BIBM-S Datasheet

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  • Philips

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Philips Semiconductors
SC16C754
Quad UART with 64-byte FIFO
鈥?/div>
For packages with leads on two sides and a pitch (e):
鈥?/div>
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
鈥?/div>
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
鈥?/div>
For packages with leads on four sides, the footprint must be placed at a 45掳 angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be 铿亁ed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
掳C
or
265
掳C,
depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated 铿倁x will eliminate the need for removal of corrosive residues in
most applications.
13.4 Manual soldering
Fix the component by 铿乺st soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the 铿俛t part of the lead. Contact time
must be limited to 10 seconds at up to 300
掳C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
掳C.
13.5 Package related soldering information
Table 27:
Package
[1]
BGA, LBGA, LFBGA, SQFP, SSOP-T
[3]
,
TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
[1]
[2]
Suitability of surface mount IC packages for wave and re铿俹w soldering
methods
Soldering method
Wave
not suitable
not suitable
[4]
Re铿俹w
[2]
suitable
suitable
suitable
not recommended
[5][6]
not recommended
[7]
suitable
suitable
suitable
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales of铿乧e.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
9397 750 11618
漏 Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data
Rev. 04 鈥?19 June 2003
46 of 49

SC16C754BIBM-S 产品属性

  • NXP

  • UART 接口集成电路

  • 4

  • 5 Mbps

  • 5.5 V

  • 2.25 V

  • 6 mA

  • + 85 C

  • - 40 C

  • LQFP-64

  • Bulk

  • SMD/SMT

  • 2.5 V, 3.3 V, 5 V

  • 250

  • SC16C754BIBM,151

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